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Lead-Free Soldering in Electronics: Science, Technology, and by Katsuaki Suganuma

By Katsuaki Suganuma

Assessing the medical and technological features of lead-free soldering, Lead-Free Soldering in Electronics considers the mandatory history and standards for correct alloy choice. It highlights the metallurgical and mechanical houses; plating and processing applied sciences; and review equipment very important to the creation of lead-free solders in electronics.A invaluable source for these attracted to selling environmentally-conscious digital packaging practices!Responding to expanding environmental and future health matters over lead toxicity, Lead-Free Soldering in Electronics discusses:Soldering inspection and designMechanical evaluate in electronics Lead-free solder paste and reflow solderingWave solderingPlating lead-free soldering in electronicsLead-Free Soldering in Electronics will profit production, electronics, and mechanical engineers, in addition to undergraduate and graduate scholars in those disciplines.

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By examining the dependence of the mechanical properties of lead-free and Sn–Pb eutectic solder as a function of temperature, strain-rate, and stress, the underlying mechanisms responsible for solder behavior changing as a function of alloy composition are beginning to be revealed. REFERENCES 1. 2. 3. NCMS Lead-Free Solder Project Final Report. Report 0401RE96, National Center for Manufacturing Sciences, 3025 Boardwalk, Ann Arbor, Michigan 48108-3266, 1997, and CD-ROM database of complete dataset, including micrographs and raw data, August, 1999.

2 lb for the SOIC device leads. 3 kg. The maximum load values for SOIC device leads as shown in Fig. 18 are characteristic of the measurements for all three device types as a function of circuit board surface finish. 40 Handwerker et al. 17 (a) Yield stress as a function of composition and temperature from IDEALS Lead-Free Project. (b) Yield stress as a function of composition and homologous temperature for Sn–40Pb and four lead-free solder alloys. 18 Pull strength of SOIC leads as a function of solder composition and surface finish.

UK progress and preliminary trials. Circuit World 9:32–34, 1993. 22. Alternative Solders for Electronic Assemblies-Final Report of DTI Project 1991– 1993. GEC Marconi, ITRI, BNR Europe, and Multicore Solders. 93. 23. JH Vincent, G Humpston. Lead-free solders for electronic assembly. GEC J Res 11:76–89, 1994. 24. WJ Boettinger, CA Handwerker, B Newbury, TY Pan, JM Nicholson. Mechanism of fillet lifting in Sn–Bi alloys. J Electron Mater 31(5):545–550, 2002. 25. K Suganuma. Microstructural features of lift-off phenomenon in through hole circuit soldered by Sn–Bi.

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