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IC component sockets by Weifeng Liu

By Weifeng Liu

A large and sensible connection with IC socket technology

the 1st and in basic terms finished source on IC (Integrated Circuit) socket expertise, IC part Sockets bargains a whole evaluation of socket expertise and layout in an effort to offer engineers and their managers with an outstanding figuring out of those really expert applied sciences and the techniques for comparing them. The authors, either said specialists within the box, tackle all correct points of the subject-including fabrics, layout, functionality features, failure modes and mechanisms, and qualification and reliability assessment-with emphasis at the technology's inherent merits and challenges.

subject matters of curiosity include:
* Socket layout and get in touch with technologies
* functionality features and fabric properties
* touch failure modes and mechanisms
* Qualification trying out conditions
* Qualification sequences and setup
* IEEE prediction methodology
* Theoretical calculation of touch reliability

together with a listing of criteria and necessities, this booklet is a crucial and well timed source for modern-day electronics engineers fascinated by comparing and perfecting socket layout, manufacture, and use

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Extra resources for IC component sockets

Sample text

6 shows the effect of wipe distance on the increase in contact resistance of copper after exposure to humidity and pollutant gases. 025 mm is required to establish low contact resistance for the design specified. For a nonlubricated, dusty electric contact surface, studies show that when the length of wipe is comparable to the size of dust particles, contact failures may arise. When the dust particle size is within the upper limit of the hazardous size range, the number of contact failures can be reduced if the wipe length is long enough [10].

1 illustrates a typical engagement process [2, 3]. The engagement force of package pins acts on the spring contacts of the socket and causes their deflection, which in turn exerts a contact normal force onto the package pins. Two stages have been used to describe the engaging process: In stage 1, a socket contact beam begins to deflect, a contact normal force is generated, and the insertion force increases rapidly. In stage 2, the contact beam is fully deflected and the package pin slides on the surface of the socket contact due to the normal force applied.

When the dust particle size is within the upper limit of the hazardous size range, the number of contact failures can be reduced if the wipe length is long enough [10]. Following the initial wipe, a back-wipe is the same action but in the opposite direction. Back-wipe has been incorporated into many socket contact designs. However, conflicting data have been reported concerning the role of back-wipe. Studies on soft and hard copper showed the ineffectiveness of a contact backwipe in improving contact performance [9].

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